Investigation of the Factors Influencing the Performance of Low Temperature SolderAuthors: Rohit Valooran, Martin Anselm, Ph.D.
Company: Department of Manufacturing and Mechanical Engineering Technology, College of Applied Science and Technology at Rochester Institute of Technology
Date Published: 9/17/2017 Conference: SMTA International
A two level three factor experiment was designed as follows: Reflow profile (High, Low), pad size (12mil, 10mil) and solder paste (Sn-58Bi and Sn-40Bi-Cu-Ni). The shear force data and the mixing percentages were compared across all factors and their interactions to determine the factors that were significant. The correlation between joint strength and mixing percentage was also analyzed.
The results show that reflow profile and pad size have a significant effect on the solder joint strength, whereas the solder paste does not have a significant effect. Also, there was a direct relationship between mixing percentage and solder joint strength.
This study demonstrates that greater solder paste volume and better solder paste volume to solder ball volume ratio, higher peak temperature and higher time above liquidus (TAL) helps in improving joint strength and mixing percentages for low temperature solder. It was also found that better solder paste mixing percentages result in higher joint shear strength.
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