The Importance of Stencil Tension for High-Yield SMT PrintingAuthors: Michael Burgess, Laszlo Gyalog
Company: ASM Assembly Systems
Date Published: 9/17/2017 Conference: SMTA International
This drive for more miniaturized devices pushes traditional manufacturing design rules, requiring different component architectures and strategies to be considered. One of the most critical processes for robust assembly of today’s smaller devices is stencil printing. In fact, the success of the print process can make or break production yield, as precise and complete solder paste transfer efficiency is central to high reliability solder joints.
stencil tension, stencil frames, stencil wear, transfer efficiency, solder paste volume
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