SMTA International Conference Proceedings


The Importance of Stencil Tension for High-Yield SMT Printing

Authors: Michael Burgess, Laszlo Gyalog
Company: ASM Assembly Systems
Date Published: 9/17/2017   Conference: SMTA International


Abstract: Electronics have pervaded the everyday lives of the global population and, increasingly, have become key enablers of human interactions. With this dependence comes the expectation of increased functionality within an ever diminishing form factor to further enable convenience and mobility.

This drive for more miniaturized devices pushes traditional manufacturing design rules, requiring different component architectures and strategies to be considered. One of the most critical processes for robust assembly of today’s smaller devices is stencil printing. In fact, the success of the print process can make or break production yield, as precise and complete solder paste transfer efficiency is central to high reliability solder joints.

Key Words: 

stencil tension, stencil frames, stencil wear, transfer efficiency, solder paste volume



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