A Scanning Chromatic Confocal Microscope for Accurate Off-Line Solder Paste Volume Measurement
Authors: Chandru Periasamy, Satyajit Walwadkar Company: Intel Corporation Date Published: 9/17/2017
Abstract: A stable, defect free manufacturing process is important to meet the increasing demands for the surface mount of electronic assemblies. Feature size and pitch reduction on printed circuit board (PCB) assemblies drive tight control of solder paste volume dispense and is increasingly critical to ensuring surface mount technology (SMT) process quality and reliability. A metrology to accurately measure solder paste volume on the PCB is a prerequisite for ensuring process stability and for understanding and preventing process excursions when they do occur. This paper will describe use of a scanning chromatic confocal microscope to quantify paste volume.