SMTA International Conference Proceedings


R1 – A Reliability Comparison Study between 14 Lead Free Alloys

Authors: Jörg Trodler, Heinz Wohlrabe
Company: Heraeus Deutschland GmbH&Co.KG , Dresden University of Technology Centre of Microtechnical Manufacturing
Date Published: 9/17/2017   Conference: SMTA International


Abstract: Solder joint reliability plays a key role in the quality of SMT-Assemblies. This paper presents a reliability study named R1. Included in this study is a reliability experiment with 14 different solder alloys (13 lead free solders and an Sn63 alloy used as a reference), six different surface finishes, six different SMD-chips combined with three different pad layouts. A high-cycle reliability test was used, where failures were evaluated using Weibull analysis, and then subjected to variance analysis.



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