SMTA International Conference Proceedings


Reliability Testing of Multiple Level Microvia Structures Following Exposure to Lead-Free Assembly

Authors: Bill Birch, Ivan Straznicky, Joe Smetana
Company: PWB Interconnect Solutions Inc., Curtiss Wright, Nokia
Date Published: 9/17/2017   Conference: SMTA International


Abstract: The High-Density Packaging User Group (HDP User Group) Consortium coordinated a project titled “Multiple Laminations in Lead-free” (Multi-lam) focused on High Density Interconnects (HDI) designs which contained 2, 3 and 4-Stacked microvias that were either placed on top of buried vias, or were offset to the buried vias. A key requirement for many OEMs using these HDI structures is understanding the short-term performance through lead free assembly and ultimately long-term reliability [1]. This project tested several constructions with different material types using Interconnect Stress Testing (IST) as the test method for obtaining and comparing reliability data on the various test cases. IST test vehicles were designed to enable resistance monitoring of various circuit configurations during current induced thermal cycling.

Key Words: 

IST, microvias, stacked, offset, lead-free assembly, PWB reliability.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819