High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste
Authors: Mary Liu, Ph.D., Wusheng Yin, Ph.D. Company: YINCAE Advanced Materials LLC Date Published: 9/17/2017
Abstract: With the advancements of the electronic industry, IC components become miniaturized, pitch size gets smaller, and I/O numbers increase. The interpose layer is also getting thinner due to the miniaturization. Therefore some copper paste has been developed for some interconnect application, which is expected to tolerate at 3X lead free reflow process cycles. During SMT assembly process red glue has to be used to avoid parts falling apart during double side reflow process. In addition, lead-free Sn/Ag/Cu soldering has higher reflow process temperatures. As a result, there are some reliability issues such as poor process yield, weak mechanical strength of solder joint, and poor thermal cycling performance, which are related to warpage. To address these issues, a few methods that have been or will be implemented include capillary underfill, corner bonding, no-flow underfill, underfilm and wafer-level underfill processes.
In order to resolve these issues, the YINCAE team has successfully developed lower or normal temperature solder joint encapsulant adhesive (SJEA) paste which can soldering at lower or normal temperature and service at higher temperature (300?C). In this paper we will discuss solder joint encapsulant paste process and reliability.