Device Assembly Considerations for Integration of One-Step Chip Attach Materials in Conventional Reflow ProcessingAuthors: Joseph Biggs, Hemal Bhavsar, Bruno Tolla, Ph.D.
Company: Kester, An ITW Company
Date Published: 9/17/2017 Conference: SMTA International
While the consideration of filler particles has been shown to be a critical factor in OSCA-R performance, other assembly parameters like device placement, dispensing conditions, and the effect(s) of the carrier system used for the substrate during reflow may not be studied in detail during material design phases. However, we demonstrate that the consideration of these assembly parameters is critical for establishing a successful integration of mature OSCA-R technologies with existing conventional reflow processes. This paper presents research focused on understanding the impact of dispensing conditions on accuracies and variability in OSCA-R transfer on the substrate, which in turn directly impacts die attach performance; additionally, the effect of placement force and speed is investigated on semiconductor packages; finally, the carrier system effect on soldering performance after conventional reflow processing is quantified and mitigated through process optimization. Preliminary results indicate that the robust integration of OSCA-R technologies into existing reflow processing schemes requires a multimodal approach combining material design considerations with dedicated application work focused on establishing a robust device assembly process. This can be best realized through a partnership leveraging the material supplier expertise and the end-user industrial manufacturing knowledge.
One-Step Chip Attach (OSCA); Reflow; Semiconductor Packaging
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