SMTA International Conference Proceedings


Low Temperature Soldering Using Sn-Bi Alloys

Authors: Morgana Ribas, Ph.D., Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury, Ph.D., Suresh Telu, Ph.D., Siuli Sarkar, Ph.D.
Company: Alpha Assembly Solutions, Alpha Assembly Solutions India R&D Centre
Date Published: 9/17/2017   Conference: SMTA International


Abstract: Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices. Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions.

Key Words: 

lead-free, Sn-Bi solders, low temperature soldering, drop shock.



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