No-Clean Flux: A Potential Ionic ContaminantAuthors: Phil Isaacs, Terry Munson
Company: IBM Corporation, Foresite, Inc.
Date Published: 9/17/2017 Conference: SMTA International
The ionic species that this paper will address are no-clean fluxes. Most PCBA’s today are soldered utilizing no-clean flux. Depending on how the flux is applied and what process conditions the flux sees, it may be totally reliable, or, it may provide a medium for electrochemical migration (ECM).
This paper will explore what process conditions and which components have a higher probability of leading to ECM. With this in mind, which tests are best suited to detect conditions which may lead a board to electrical failure.
No-clean, Flux, Process, Fails, SIR, C3 and IC
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