Embedded Power Electronic Modules Realized by PCB EmbeddingAuthors: Lars Boettcher, S. Karaszkiewicz, Th. Löher, D. Manessis, A. Ostmann
Company: Fraunhofer Institute for Reliability and Microintegration (IZM), Technical University of Berlin
Date Published: 9/17/2017 Conference: SMTA International
For power applications, the embedded system layout has to account for high currents and/or voltages and at the same time has to provide means to facilitate the power dissipation from the embedded components. PCB-substrates and modules therefore contain conductor traces with large cross sections and/or massive copper and ceramic structures in order to enable the required heat spreading. Such constructions are composed of materials with different CTEs. As a result, considerable stresses prevail in the buildup layers. In contrary to conventional PCBs, the build-up of power modules are non-symmetrical and a careful layout of embedded modules is necessary in order to avoid warpage of the package.
A large variety of embedded power electronic modules has been realized so far. Size and performance of the systems differ accordingly. They range from modules with lateral dimensions of a few square millimeters having a few components embedded for low voltage and currents of up to 50 Amperes, to complex assemblies with 24+ embedded semiconductors and a module area of several square decimeters for an operating Voltage of 600 V and a total power of 150 kW.
The present paper will give an overview of different developments and results in power electronic embedding using PCB technologies. A variety of results from recent projects dealing with embedded power modules will be presented.
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