SMTA International Conference Proceedings


PIN-IN-PASTE SOLDER PROCESS DEVELOPMENT

Authors: Raiyo Aspandiar
Company: Intel Corporation
Date Published: 9/12/1999   Conference: SMTA International


Abstract: The Pin-in-Paste process can be used to solder through hole components using surface mount assembly process steps. Solder paste is printed into and around the through holes and the component pins are then inserted into the holes. The development of such a process at Intel’s Systems Manufacturing Technology Division will be described. The impact of many parameters on the formation of acceptable solder joints by this process was studied. These parameters included the stencil thickness and aperture designs, the number of rows of component pins and their pitch, the through hole diameters, and the pin dimensions of the components. Machine insertion of the through hole parts was also evaluated. A two-sided printing process was developed for sub 100 mil pitch connectors with 4 or more rows of pins.



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