SMTA International Conference Proceedings


Reliability of CGA/PGA Assemblies Under Harsh Thermal Cycles

Authors: R. Ghaffarian, A. Choubey, T. Goodsall
Company: Jet Propulsion Laboratory, California Institute of Technology
Date Published: 9/17/2017   Conference: SMTA International


Abstract: This paper presents assembly reliability of advanced commercial –off-the-shelf (COTS) column grid array (CGA) compared to decades old pin grid array (PGA) packaging technology under harsh thermal cycle conditions. CGAs were assembled by surface mount technology (SMT) method whereas PGAs, being plated through (PTH) packages, were assembled by hand soldering. The eutectic tin-lead solder either in paste or solid wire were used for soldering. It is a general perception that the PTH technologies are an order of magnitude more robust in thermal cycle reliability than SMTs. However, this may not be true under harsh environmental conditions. Design for reliability (DfR) with compromising on the assembly PGA stand-off height and the printed circuit board (PCB) thickness may be required to achieve the desired long-term reliability. This paper presents key parameters affecting the reliability of CGA and PGA assemblies as well as associated test results under harsh thermal shock/cycle conditions

Key Words: 

Column grid array, CGA, solder joint reliability, tin-lead solder, thermal cycle, extreme cold cycle, thermal shock cycle, pin grid array, PGA, Failure Mechanisms of CGA/PGA under Harsh Thermal Cycles



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