Mitigation Strategies to Enhance Product-Level BGA Shock Performance for Various Heat Sink Attachment MethodologiesAuthors: Weidong Xie, Cherif Guirguis, Mudasir Ahmad, Jianghai Gu
Company: Cisco Systems, Inc.
Date Published: 9/17/2017 Conference: SMTA International
This study investigates the maximum PCB strains near large BGA assemblies under different HS attachment and at various weights. A BGA assembly has been excised from a product to create a test vehicle (TV) that is similar to JEDEC standard component-level qualification shock TV. The TV is tested with different weight metal blocks that were mounted on the BGA component to simulate different HS: 157g for Aluminum HS and 744g for large Copper HS. A design of experiment (DOE) is executed to capture key interactions between the HS weight and attachment method. The shock testing results have been applied to guide the development and enhancement of product-level shock performance. Subsequent product-level packaging drop tests proved the effectiveness of the enhancement strategies. The findings of this study are helpful in developing guidelines for designing HS attachments to enhance product-level shock performance and providing empirical insights for numerical modeling benchmarking.
BGA, reliability, shock, package drop, productlevel shock.
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