Solder-Joint Reliability of a Large Body Molded Array PackageAuthors: Burton Carpenter, Andrew Mawer, Betty Yeung
Company: NXP Semiconductors, Inc.
Date Published: 9/17/2017 Conference: SMTA International
This paper describes experimental and simulation work to study SJR of a 1.0mm pitch, 27mm body BGA package used in automotive under-the-hood applications. Both MAPBGA (molded array BGA) and TEPBGA (individually molded thermally enhanced BGA) packages were testing in TCoB (temperature cycle on board) in AATS (air-to-air thermal shock) between -40ºC and +125ºC. The target requirement was to pass 3000 cycles before the first failure.
The solder-joint lifetime was observed to depend on the PCB (printed circuit board) pad diameter. Both MAPBGA and TEPBGA packages performed well and behaved similarly for larger diameter pads. However, for the smallest PCB pad, the MAPBGA failed prematurely. Failure analysis determined that the corner solder-joints were the culprits. Simulations confirmed the trend, demonstrating that for sufficiently small PCB pads, the failure location moves from the package side to the PCB side of the solder-joint with reduced lifetime.
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