High Performance Electronic Interconnect Materials Characterization - Techniques & ChallengesAuthors: Nicholas Herrick, Amit Patel, Gyan Dutt and Ranjit Pandher
Company: Alpha Assembly Solutions
Date Published: 9/17/2017 Conference: SMTA International
In this study, a series of interconnect materials, including sintered nano-silver, SAC305 and a hybrid silver sintering epoxy, were used to assemble high-power AlGaInP/Si LEDs for laboratory testing. Junction temperature, thermal resistance, thermal conductivity, total luminous flux, peak wavelength, and efficiency were measured according to JESD51-1 and LM-79-08.
In this paper we discuss the technical and design challenges associated with making accurate thermal resistance measurements across a multi-layered stack. The results of this laboratory study show the comparative performance of identical devices assembled with a variety of interconnect materials. A field example showing enhanced UV LED device performance with high thermal interconnect material is presented.
UV LED, die attach, sintered silver, thermal resistance, interconnects
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