Author: David Hillman Company: Rockwell Collins Date Published: 9/17/2017
Abstract: SMT electrolytic capacitors are a widely used component technology on IPC Class 3 avionics product designs. The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. The use of adequate reflow soldering processes is therefore critical for producing solder joints that are acceptable for their end product use environment. In conjunction with an IPC-JSTD-001 task group effort to create solder joint acceptance criteria for SMT electrolytic capacitors, an investigation was conducted to identify critical solder joint attributes using thermal cycle conditioning and shear testing. A recommended set of solder joint acceptance criteria was defined using the test results. This paper documents the investigation and the test results.