ICSR (Soldering and Reliability) Conference Proceedings


A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance - Part 1

Author: Jason Fullerton
Company: Alpha Assembly Solutions
Date Published: 6/6/2017   Conference: ICSR (Soldering and Reliability)


Abstract: This study is an investigation and comparison of the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system and surface insulation resistance (SIR) testing.

The flux test coupons for both tests were prepared in accordance with IPC TM-650 2.6.3.3. The IPC B-24 coupons used were manufactured using a lead-free wave solder process. Coupons were then tested for SIR per J-STD-004B using IPC TM-650 2.6.3.7, and tested with localized cleanliness testing.

The results for six no-clean fluxes are presented: two fluxes are alcohol-based formulations with rosin, two fluxes are alcohol-based rosin-free formulations, and two fluxes are VOC-free formulations.

A divergence in test results is observed between the J-STD-004B SIR pass/fail requirement of 100 MO minimum and the clean/dirty results provided by the cleanliness test system. The SIR resistance/time graphs and cleanliness tester current/time graphs are compared.

Key Words: 

localized cleanliness testing, SIR, liquid flux



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