A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance - Part 1Author: Jason Fullerton
Company: Alpha Assembly Solutions
Date Published: 6/6/2017 Conference: ICSR (Soldering and Reliability)
The flux test coupons for both tests were prepared in accordance with IPC TM-650 188.8.131.52. The IPC B-24 coupons used were manufactured using a lead-free wave solder process. Coupons were then tested for SIR per J-STD-004B using IPC TM-650 184.108.40.206, and tested with localized cleanliness testing.
The results for six no-clean fluxes are presented: two fluxes are alcohol-based formulations with rosin, two fluxes are alcohol-based rosin-free formulations, and two fluxes are VOC-free formulations.
A divergence in test results is observed between the J-STD-004B SIR pass/fail requirement of 100 MO minimum and the clean/dirty results provided by the cleanliness test system. The SIR resistance/time graphs and cleanliness tester current/time graphs are compared.
localized cleanliness testing, SIR, liquid flux
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