Low Silver SAC-Bi Lead-Free Solder for Reliable ApplicationsAuthors: Mehran Maalekian, Ph.D., Karl Seelig
Company: AIM Metals & Alloys
Date Published: 6/6/2017 Conference: ICSR (Soldering and Reliability)
Bi-containing alloys and other micro-alloys are emerging as the next generation of enabling technologies. Bi has a long history in the solder alloy market. It lowers the solder melting point, improves wetting, improves mechanical performance and is relatively inexpensive. These characteristics address the major shortcomings of many of the lead-free solders in the market today. Hence, in this paper we study the effect of Bi on microstructure, mechanical performance and soldering properties of a low silver SAC alloy. It is demonstrated that adding Bi (<3wt%) would improve soldering and mechanical behavior of low silver SAC alloy. The reliability and stability of this Bi-containing low silver SAC is presented and compared with SAC305.
Lead-free solder, reliability, electronic assembly, mechanical properties
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