Author: FRANK SILVA Company: NICOLET IMAGING SYSTEMS Date Published: 11/16/1998
Abstract: Today’s surface mount assembly line provides many challenges to the process engineer. With the increase in package densities, the need for real-time, accurate, and informative process performance data is a necessity. We will review the various process monitor technologies available, where process defects are introduced and how using x-ray technology can provide soldering process measurement information. Included will be a discussion of how this information can be used to monitor other elements of the SMT line resulting in a high quality, reliable assembly.