Emerging Technologies Conference Proceedings


AN SMT PROCESS MONITOR FOR HIGH-DENSITY PACKAGING

Author: FRANK SILVA
Company: NICOLET IMAGING SYSTEMS
Date Published: 11/16/1998   Conference: Emerging Technologies


Abstract: Today’s surface mount assembly line provides many challenges to the process engineer. With the increase in package densities, the need for real-time, accurate, and informative process performance data is a necessity. We will review the various process monitor technologies available, where process defects are introduced and how using x-ray technology can provide soldering process measurement information. Included will be a discussion of how this information can be used to monitor other elements of the SMT line resulting in a high quality, reliable assembly.



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