FLUX-FREE PROCESS FOR PLACEMENT AND ATTACH OF SOLDER BALLS TO WAFERS, FLIP CHIPS AND ALL BGA PACKAGESAuthor: RICHARD RAMOS
Company: SCIENTIFIC SEALING TECHNOLOGY
Date Published: 11/16/1998 Conference: Emerging Technologies
The demand for flip chip technology and BGA devices has steadily increased and more efficient high volume manufacturing assembly methods need to be developed to keep pace. Ball attachment production yields also need to be improved so that the cost of manufacturing can be reduced. In response to this challenge, SST has developed a new and more cost effective method of placing and attaching solder balls to wafers, to plastic and ceramic packages for BGA application. The new method virtually eliminates the problems associated with the currently used methods.
The SST process utilizes specially designed tooling for loading and precisely holding solder balls in the required position during processing. The soldering operation is performed without flux in a controlled atmosphere. As a result, presolder paste screening and post solder cleaning operations are not required. The SST ball attachment process for wafers is performed at the wafer level prior to singulation thereby maximizing production capability. The ball attachment process for BGA packages is also very efficient.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.