The Effect Of Board Design On Electroplated Copper Filled Thermal Vias For Heat ManagementAuthors: Carmichael Gugliotti, Rich Bellemare
Company: MacDermid Enthone Electronics Solutions
Date Published: 3/28/2017 Conference: Symposium
The ability of the process to fill a variety of through hole sizes on substrates of varying thickness while minimizing the overall surface copper build up are critical in applications requiring efficient thermal management as circuit miniaturization continues.
The through hole fill technology and the results of a recent design of experiments investigating the effects of a variety of factors such as substrate thickness, through hole diameter, plating cycle, current density, and plating time will be presented in this paper.
PPR electroplating, Via Fill, Thermal Management, Through Hole Fill
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