Symposium Conference Proceedings

The Effect Of Board Design On Electroplated Copper Filled Thermal Vias For Heat Management

Authors: Carmichael Gugliotti, Rich Bellemare
Company: MacDermid Enthone Electronics Solutions
Date Published: 3/28/2017   Conference: Symposium

Abstract: This paper discusses a through hole copper filling process for application in high density interconnect constructions on thin IC and LED substrates where high reliability and thermal management are essential. The process consists of a two step acid copper plating cycle. The first step utilizes periodic pulse reverse electroplating to form a conductive copper bridge across the middle of a through hole followed by direct current electroplating to fill the resultant vias formed in the bridge cycle.

The ability of the process to fill a variety of through hole sizes on substrates of varying thickness while minimizing the overall surface copper build up are critical in applications requiring efficient thermal management as circuit miniaturization continues.

The through hole fill technology and the results of a recent design of experiments investigating the effects of a variety of factors such as substrate thickness, through hole diameter, plating cycle, current density, and plating time will be presented in this paper.

Key Words: 

PPR electroplating, Via Fill, Thermal Management, Through Hole Fill

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