Development Of A Risk Profile From Flux Residues Trapped Under Leadless ComponentsAuthors: Mike Bixenman, DBA, T.C. Loy and Bruno Tolla, Ph.D., Denis Jean, Jennifer Allen, Kyle Loomis
Company: Kyzen Corporation and Kester Corporation
Date Published: 3/28/2017 Conference: Symposium
This research study will use a non-standard test board with sensors placed within the body of the component. The boards will be built with halide free and halogen bearing soldering pastes. The boards will be reflowed using a ramp-to-spike and soak profile. A subset of the boards will not be cleaned, a subset cleaned but with some residue remaining under the component and a subset totally cleaned. Surface Insulation Resistance testing of the boards will be used to develop a risk profile for residues remaining under the body of the components.
Bottom Terminated Components, QFNs, No-Clean Solder Paste, Flux Outgassing, Cleaning
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