Emerging Technologies Conference Proceedings


CHIP SCALE PACKAGE DESIGN CHALLENGES

Author: ROBERT L. HUBBARD
Company: MEDTRONIC
Date Published: 11/16/1998   Conference: Emerging Technologies


Abstract: The new chip scale packages like the BGA have advantages of small size, high reliability, ease of placement and bonding and reasonable cost. They are rapidly becoming the package of choice for flash, SRAM and DRAM memories and are being built in quantities of millions per month. This paper describes some experiences with several BGA designs, other chip scale packages, and high-density printed wiring boards. Some of the infrastructure issues for small manufacturers are described as well as comparisons of reliability data for BGAs, CSPs and flip chip. Keywords: microBGA, chip scale package, BGA, CSP, design, reliability, flip chip, medical



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819