Mixed-Signal Glass Module For IOT ApplicationsAuthors: Srikrishna Sitaraman¹, Tony Contreras¹, Ray Kahidi¹, Ganesh Bhatt², Terry Bowen³ and Mohammad Ahmed²
Company: ¹Tyco Electronics Corporation, ²TE Connectivity Ltd. Company Corporate Technology ³Advanced Electronic Solutions Corporate Technology
Date Published: 2/6/2017 Conference: Pan Pacific Symposium
This paper demonstrates the first-ever 3D mixed-signal module on thin glass substrate with double-side metallization and components. The ZigBee module on glass substrate was designed, fabricated, assembled, and tested; and has been certified to be an FCC-compliant Class-A device. The design, electromagnetic analysis, fabrication, assembly and testing of the module are described in this paper.
Glass Interposer, Through Glass Vias, ZigBee, RF, Double-side
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