Pan Pacific Symposium Conference Proceedings


Mixed-Signal Glass Module For IOT Applications

Authors: Srikrishna Sitaraman¹, Tony Contreras¹, Ray Kahidi¹, Ganesh Bhatt², Terry Bowen³ and Mohammad Ahmed²
Company: ¹Tyco Electronics Corporation, ²TE Connectivity Ltd. Company Corporate Technology ³Advanced Electronic Solutions Corporate Technology
Date Published: 2/6/2017   Conference: Pan Pacific Symposium


Abstract: Significant advances have been made to lower the power consumed by active and passive components, a lot of integration still happens either on-chip or on PCB. On-chip RF integration, also known as RF system-on-chip (SoC), achieves miniaturization on silicon substrate but is expensive and results in higher loss, especially for analog RF signals. On the other hand, integration at the PCB-level sacrifices size for lower cost and lower loss. Therefore, there is a need to achieve miniaturization without compromising on the performance or increasing the cost. In this paper, glass is proposed and demonstrated as a capable substrate material for miniaturization of RF modules at low loss and reasonable cost.

This paper demonstrates the first-ever 3D mixed-signal module on thin glass substrate with double-side metallization and components. The ZigBee module on glass substrate was designed, fabricated, assembled, and tested; and has been certified to be an FCC-compliant Class-A device. The design, electromagnetic analysis, fabrication, assembly and testing of the module are described in this paper.

Key Words: 

Glass Interposer, Through Glass Vias, ZigBee, RF, Double-side



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