Investigating Test Methods For Electrochemical Consistency In PCB Assembly ProcessesAuthors: Brook Sandy-Smith
Company: Indium Corporation
Date Published: 2/6/2017 Conference: Pan Pacific Symposium
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance, electrochemical migration, ROSE extraction, and other emerging test methods. Data will be shared showing how different methods can detect process variations in different ways, results will be compared.
SIR, ECM, ROSE, IC, electrochemical migration, ionic residue, reliability
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