Reliability Improvement Of Cu-Wire Bonded Lead Frame Package For Automotive ApplicationsAuthors: Tatsunori Saruwatari, Toru Takahashi, Akinori Ono, Yuichi Asano, Toshihiro Iwasaki, Mitsuru Ooida, Yoichi Hiruta
Company: J-Devices Corporation
Date Published: 2/6/2017 Conference: Pan Pacific Symposium
In this paper, we clarified that S also has an important role in the failure mechanism similar to Chlorine (Cl) by more detailed failure analysis. The S atoms attack the Cu9Al4 Inter-Metallic Compound (IMC) especially at high temperature, causing dry corrosion and creating a gap. We introduced a new index of Al-Cu interconnection reliability. The new index is the ratio of sustained bonding area Ks = Asustained bond / Abond, where Asustained bond is the sustained bonding area after HTST and Abond is the initial bonding area. It is found out that Ks depends on the S containment in the molding compound by changing the amount of S. And we verified that Cu-wire bonding technology had sufficient reliability for automotive applications due to the newly improved molding compound which contained a minimized amount of Cl and S.
Cu-wire, AEC-Q100 Grade0, Lead Frame, HTST, Dry corrosion, Sulfur free
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