Pan Pacific Symposium Conference Proceedings


Reliability Improvement Of Cu-Wire Bonded Lead Frame Package For Automotive Applications

Authors: Tatsunori Saruwatari, Toru Takahashi, Akinori Ono, Yuichi Asano, Toshihiro Iwasaki, Mitsuru Ooida, Yoichi Hiruta
Company: J-Devices Corporation
Date Published: 2/6/2017   Conference: Pan Pacific Symposium


Abstract: High reliability of packages has been required, especially for automotive applications. For automotive applications, the package reliability has focused on a temperature storage test higher than 175?. In the case of AEC Q100 Grade0, we found out that it is important to consider corrosion mechanism by elements such as Sulfur (S) at Cu-Al alloy at the bonding interface under the High Temperature StorageTest (HTST).

In this paper, we clarified that S also has an important role in the failure mechanism similar to Chlorine (Cl) by more detailed failure analysis. The S atoms attack the Cu9Al4 Inter-Metallic Compound (IMC) especially at high temperature, causing dry corrosion and creating a gap. We introduced a new index of Al-Cu interconnection reliability. The new index is the ratio of sustained bonding area Ks = Asustained bond / Abond, where Asustained bond is the sustained bonding area after HTST and Abond is the initial bonding area. It is found out that Ks depends on the S containment in the molding compound by changing the amount of S. And we verified that Cu-wire bonding technology had sufficient reliability for automotive applications due to the newly improved molding compound which contained a minimized amount of Cl and S.

Key Words: 

Cu-wire, AEC-Q100 Grade0, Lead Frame, HTST, Dry corrosion, Sulfur free



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