Emerging Technologies Conference Proceedings


PREDICTING ASSEMBLY COSTS BEFORE DESIGN WITH THE DESIGN REPORT CARD

Author: Happy T. Holden
Company: Techlead Corporation
Date Published: 11/16/1998   Conference: Emerging Technologies


Abstract: The Design Report Card was first introduced by IBM-Austin ECAT Facility in 1992. This paper refines and expands the technique to include the Printed Circuit Board Design Report Card and an extended Assembly Report Card that includes Flip Chip assembly.

The Design Report Card is a predictive engineering methodology that characterizes the various features of a manufacturing process into design points. These design points can then be related directly to manufacturing costs. This allows the easy trade-off of characteristics to find the optimum design.

The Assembly Report Card has its matrix of features expanded but the new PCB Design Report Card has a new section that allows the estimation of the first pass yield if the PCB fabrication process. This is the most important part of projecting the manufacturing costs, since the PCB yield can drive costs to very high values. The first pass yield is driven by the PCB design characteristics and are incorporated into a measure of its sophistication, the Complexity Index. The original Complexity Index was developed by Hewlett-Packard in 1986. This paper extends that algorithm to include the new HDI microvias and fine geometry’s required for Flip Chip mounting.



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