Pan Pacific Symposium Conference Proceedings

Industry Trends In Photonics Packaging: Passive Fiber and Die Coupling

Authors: Shalomin Thomas, Keyla Y. Bastardo, and Martin K. Anselm, Ph.D.
Company: Rochester Institute of Technology
Date Published: 2/6/2017   Conference: Pan Pacific Symposium

Abstract: This paper will take a broad look at current photonics packaging strategies and discuss leading research conducted by industry and academia. Photonics integration has similar challenges as 3D electronics packaging integration with the added complexity of high accuracy fiber attach and alignment. Decisions on chip edge and chip surface optical coupling are still being decided as evidenced by the continuous evolution of designs and innovations being presented in the contemporary literature. This evolution is in part driven by the need to develop unique solutions for product-driven low-volume applications in medical, military and automotive sensing technologies. Since silicon photonics integration is a new technology there is not one common architecture that is being followed. However, most designs heavily leverage current silicon electronics wafer level fabrication techniques. Until a single wafer and packaging method is adopted manufacturers must prepare for numerous design possibilities. This paper will provide a snapshot of wafer-level coupling and packaging technologies being developed as described in the current literature.

Key Words: 

Photonics packaging, fiber attach, die coupling, photonic trends

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819