Industry Trends In Photonics Packaging: Passive Fiber and Die Coupling
Authors: Shalomin Thomas, Keyla Y. Bastardo, and Martin K. Anselm, Ph.D. Company: Rochester Institute of Technology Date Published: 2/6/2017
Pan Pacific Symposium
Abstract: This paper will take a broad look at current photonics packaging strategies and discuss leading research conducted by industry and academia. Photonics integration has similar challenges as 3D electronics packaging integration with the added complexity of high accuracy fiber attach and alignment. Decisions on chip edge and chip surface optical coupling are still being decided as evidenced by the continuous evolution of designs and innovations being presented in the contemporary literature. This evolution is in part driven by the need to develop unique solutions for product-driven low-volume applications in medical, military and automotive sensing technologies. Since silicon photonics integration is a new technology there is not one common architecture that is being followed. However, most designs heavily leverage current silicon electronics wafer level fabrication techniques. Until a single wafer and packaging method is adopted manufacturers must prepare for numerous design possibilities. This paper will provide a snapshot of wafer-level coupling and packaging technologies being developed as described in the current literature.
Photonics packaging, fiber attach, die coupling, photonic trends