Thermal Cycling Testing To Failure Of A Ceramic Column Grid Array¹ Package For Space Applications²Authors: Rajeshuni Ramesham, Ph.D.
Company: Component Engineering and Assurance Office, Office of Safety and Mission Success Jet Propulsion Laboratory, California Institute of Technology
Date Published: 2/6/2017 Conference: Pan Pacific Symposium
In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C.
The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermalcycle reliability test data for ~2500 thermal cycles.
Ceramic column grid array, CCGA 1752 (CN version) qualification, CCGA reliability, solder-joint failures, thermal cycling
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