Emerging Technologies Conference Proceedings


APPLICATIONS AND TECHNOLOGY TRENDS FOR CHIP SCALE AND NEAR CHIP SCALE PACKAGES

Author: Paul Hoffman
Company: Amkor Technology
Date Published: 11/16/1998   Conference: Emerging Technologies


Abstract: One of the hottest topics in electronics assembly today is small format packaging. The terms Chip Scale Package (CSP) or Near Chip Scale Package (NCSP) denote a variety of package types whose goal is to minimize the size, height, and weight of the package while satisfying the other demands placed on the package by its intended application. This paper will review some of the various BGA format CSP and NCSP packages available in the market today.

Keywords: Chip Scale Package, CSP, NCSP, BGA



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