Patterned Adhesive Transfer for Wafer Level Packaging ApplicationsAuthors: Thomas Uhrmann, Elisabeth Brandl, Jürgen Burggraf, Christine Thanner and Markus Wimplinger
Company: EV Group GmbH
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
A novel process solution is the transfer of thin adhesive layers, such as bond frames or sealing rings. This can be accomplished by different process flows. In a first process flow, the adhesives can be patterned on a donor substrate. Such substrates can be of different materials, such as silicon on glass. Here, the adhesive is patterned and following the pattern is transferred to the actual device wafer using aligned wafer bonding. In a second approach, the topography of the device wafer is facilitated. Also here a donor substrate is prepared with the adhesive layer of specified thickness and film properties. Without any alignment needs the donor is brought into contact with the device wafer and the actual transfer process is done, leaving a structured adhesive film and a ready to bond substrate.
Following, we will present details of both above described process flows. We will present a study using different adhesive materials, carrier substrates and different stages of material cure and compare their properties for wafer-level adhesive bonding of wafer level packages.
Adhesive Bonding, Adhesive Patterning, Adhesive Transfer, Packaging, Biotechnology
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