IWLPC (Wafer-Level Packaging) Conference Proceedings


Patterned Adhesive Transfer for Wafer Level Packaging Applications

Authors: Thomas Uhrmann, Elisabeth Brandl, Jürgen Burggraf, Christine Thanner and Markus Wimplinger
Company: EV Group GmbH
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Adhesive bonding with a patterned resist offers distinct advantages for several packaging application such as wafer bonding at low temperature, lower particle and defect sensitivity and surface topography and the ability to bond different materials to each other. Especially in the consumer market, wafer level packaging using adhesive bonding offers a cost effective option. On the other hand, the patterning of adhesives by photo lithography may add restrictions to functional surfaces, movable parts or orifices on the wafer that might easily be clogged by the adhesives.

A novel process solution is the transfer of thin adhesive layers, such as bond frames or sealing rings. This can be accomplished by different process flows. In a first process flow, the adhesives can be patterned on a donor substrate. Such substrates can be of different materials, such as silicon on glass. Here, the adhesive is patterned and following the pattern is transferred to the actual device wafer using aligned wafer bonding. In a second approach, the topography of the device wafer is facilitated. Also here a donor substrate is prepared with the adhesive layer of specified thickness and film properties. Without any alignment needs the donor is brought into contact with the device wafer and the actual transfer process is done, leaving a structured adhesive film and a ready to bond substrate.

Following, we will present details of both above described process flows. We will present a study using different adhesive materials, carrier substrates and different stages of material cure and compare their properties for wafer-level adhesive bonding of wafer level packages.

Key Words: 

Adhesive Bonding, Adhesive Patterning, Adhesive Transfer, Packaging, Biotechnology



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