Electrodeposition of Ø50 × 50 µm Cu Pillars for 3D Stacking ApplicationsAuthors: Zaid El-Mekki, Harold Philipsen, Mia Honore, Aleksandar Radisic, John Slabbekoorn, Herbert Struyf, Marco Arnold, Alexander Fluegel, Dieter Mayer, Iris Shu-Ya Chang
Company: imec and BASF
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
3D stacking, electrochemical deposition, plating, Cu, pillar, bump, shape, wafer-level, height uniformity, deposition rate
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