IWLPC (Wafer-Level Packaging) Conference Proceedings

Thin Wafer Handling Technologies for TSV Packaging

Authors: Amandine Pizzagalli, Santosh Kumar, Thibault Buisson
Company: Yole Développement- Advanced Packaging & Semiconductor Manufacturing Team
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)

Abstract: TSV is the key technology for 3D memory and 2.5D interposer application which has been already introduced in the latest Samsung’s product DDR4 and in the HBM memories and GPU stacked onto a Si interposer led by AMD and SK Hynix.

However, fabrication of TSV requires several critical processes steps including temporary bonding and debonding (TB/DB) which is one such key enabling technology for handling and double-side processing of extremely thin TSV wafers.

There are a wide variety of debonding technologies available: Thermal release debonding process, laser debonding technologies based on either solid state or excimer, solvent chemical release, mechanical release with multilayer adhesive as well as Zone Bond.

Today, mechanical and excimer laser debonding technologies are the two technologies best suited to both 2.5D and 3D applications.

Mechanical debonding process is more popular for device manufacturers (IDM) due to the need of using a Silicon carrier based process. Although, laser debonding exhibits higher throughput, it offers less flexibility in terms of possible carrier wafer’s types since it only works with glass carrier wafer. However, such carrier wafer contains sodium material which presents contamination issues to front-end manufacturers.

While the mechanical type debonding process is mainly chosen by IDMs, the leading Outsourced Assembly and Test houses (OSATs) have started with mechanical slide-off debonding and they are switching to laser debonding due to advantages that this technology exhibits such as lower stress and lower risk of wafer breakage.

In addition, the selection of a suitable temporary adhesive is also one of the key criteria to make the process successful since this material should withstand high temperature and leave no residue on the device wafer after the debonding process.

Thus, choosing the most suitable technology will depend on cost, process performance but also internal fabs’ requirements and capabilities.

This work addresses the key technical trends and challenges in thin wafers handling for TSV packaging with insights on the competitive landscape in this field.

Key Words: 

thin wafer handling, TSV, Bonding and Debonding, mechanical debonding, laser debonding, IDM, OSATs

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