Advanced Packaging Lithography and Inspection Solutions for Next Generation FOWLP-FOPLP ProcessingAuthors: Keith Best, Gurvinder Singh, and Roger McCleary
Company: Rudolph Technologies, Inc.
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
This paper discusses the lithography process challenges that have ensued from disruptive FOWLP, and more recently the paradigm shift to fan-out panel level packaging (FOPLP). The work reports on lithography solutions for CD control over topography and high aspect ratio imaging of 2µm line/space RDL. In addition, the introduction of new inspection capabilities for defects and metrology is reported for both wafers and panels. The increase in lithography productivity and cost reduction provided by FOPLP is also discussed with production examples.
FOWLP, Panel, Stepper, thick resist, inspection, fluorescence
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