IWLPC (Wafer-Level Packaging) Conference Proceedings


Advances and Applications of Gold Electroplating to Semiconductor Devices

Authors: Theresa Souza, Anthony Gallegos, Tom Tyson, Bob Forman, Lynne Michaelson, Ph.D.
Company: Technic Inc and 1 Zone, LLC
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Over the years, thick Gold films have been applied to wafers to utilize Gold's unique electrical and mechanical properties. This paper will review the current "state of the art" application of Gold Plating onto wafers, substrates, and wafer level packages by electroplating. The presentation will also examine new developments in formulations of cyanide (CN) free chemistries that offer improved ease of use, neutral pH, higher stability, and are free of heavy metal additives.

Key Words: 

gold electroplating, cyanide free, acidic gold plating, sulfite gold, acid sulfite gold, gold sulfite



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