Sub-µM 3D For RDL Structures In FO-WLP and Advanced Packaging Using Mult-Sensor InterferometryAuthors: Moritz Jurgschat, Matthias Weber and Ramon Tuason
Company: Sentronics Metrology GmbH and Quantum Analytics
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
This paper presents a versatile state-of-the-art metrology tool that is capable of measuring the complete process flow with its multi-sensor approach. A high-resolution white-light interferometer (WLI) is used to measure the step heights and CDs of UBM structures with sub-µm vertical and horizontal resolution. The patented Spectral Coherence Interferometry (SCI) technology is used to measure the coating thickness before the exposure step. This is done with a rate of up to 4 kHz enabling full wafer maps to optimize typical areas of low yield such as the center and edge of the wafer.
Under Bump Metallization (UBM), Redistribution Layer (RDL), Fan-Out Packaging, Mold Wafer, White Light Interferometry, Spectral Coherence Interferometry, Critical Dimension (CD)
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.