MULTILAYER HIGH DENSITY FLEX INTERCONNECTAuthor: BILL CHOU
Company: Fujitsu Computer PackagingTech
Date Published: 11/16/1998 Conference: Emerging Technologies
This paper discusses the development of ultra-high density flexible circuits. Processes and materials to fabricate fine line pitches from 12.5 µm to 40 µm are examined. Various microvia structures, through hole and blind via, are demonstrated. A test vehicle was designed and built for BGA packages to illustrate the density capability. A four-layer structure is demonstrated by using Z-connection to connect two layer pairs. Electrical, mechanical, and reliability test results are presented to show the selection of flex substrate material, Z-connection methodology and fabrication processes. A cost comparison of high-density flex to alternative substrates is discussed to identify potential applications.
Key Words: flex, substrate, high density, Z-connection
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