Rapid Polymer Curing For Improved Manufacturing Metrics
Authors: J. Yusi, B. Rogers, R. Valencia, C. Sandstrom, C. Scanlan, and T. Olson Company: Deca Technologies, Inc. Date Published: 10/18/2016
IWLPC (Wafer-Level Packaging)
Abstract: The impact of performing rapid cure on photo-imageable polymers used on wafer level chip scale packaging (WLCSP) and wafer level fan-out (WLFO) has been studied through experimentation and reliability tests. The process consists of a cross linking pre-treatment followed by hotplate curing in a low oxygen environment. Able to be accomplished in as little as 20 minutes, rapid cure cuts down conventional cure cycle time by greater than 90% and consequently reduces manufacturing work-in-progress (WIP), while demonstrating good via metrology control, similar mechanical properties, and good part reliability when compared to conventional curing.