IWLPC (Wafer-Level Packaging) Conference Proceedings


Rapid Polymer Curing For Improved Manufacturing Metrics

Authors: J. Yusi, B. Rogers, R. Valencia, C. Sandstrom, C. Scanlan, and T. Olson
Company: Deca Technologies, Inc.
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The impact of performing rapid cure on photo-imageable polymers used on wafer level chip scale packaging (WLCSP) and wafer level fan-out (WLFO) has been studied through experimentation and reliability tests. The process consists of a cross linking pre-treatment followed by hotplate curing in a low oxygen environment. Able to be accomplished in as little as 20 minutes, rapid cure cuts down conventional cure cycle time by greater than 90% and consequently reduces manufacturing work-in-progress (WIP), while demonstrating good via metrology control, similar mechanical properties, and good part reliability when compared to conventional curing.

Key Words: 

Wafer Level Chip Scale Packaging, Wafer Level Fan-Out, Polymer Curing



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