Cost Analysis of Die Assembly For 2.5D and 3D PackagingAuthors: Chet A Palesko and Amy P Lujan
Company: SavanSys Solutions LLC
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
This paper will provide focused cost analysis of the 2.5D and 3D die assembly process. The cost and yield of current assembly technologies will be analyzed, including the impact on the total packaging cost. Assembly cost improvements will be evaluated to understand the potential savings associated with increasing die assembly throughput, increasing the process yield, and using wafer-to-wafer assembly.
2.5D Packaging, 3D, Cost, Die Bonding
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