IWLPC (Wafer-Level Packaging) Conference Proceedings

Cost Analysis of Die Assembly For 2.5D and 3D Packaging

Authors: Chet A Palesko and Amy P Lujan
Company: SavanSys Solutions LLC
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)

Abstract: In spite of the relatively high cost, 2.5D and 3D packaging can provide significant size and performance advantages over other packaging technologies. Products such as high end FPGAs, high performance GPUs, and high bandwidth memory are target applications for these technologies, but none have the volume requirements of mobile phones and tablets. Without high volume to drive changes, future cost reduction will only result from progress on individual activities in the 2.5D and 3D manufacturing process. One of the significant cost drivers for 2.5 and 3D packaging is the die assembly cost.

This paper will provide focused cost analysis of the 2.5D and 3D die assembly process. The cost and yield of current assembly technologies will be analyzed, including the impact on the total packaging cost. Assembly cost improvements will be evaluated to understand the potential savings associated with increasing die assembly throughput, increasing the process yield, and using wafer-to-wafer assembly.

Key Words: 

2.5D Packaging, 3D, Cost, Die Bonding

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