IWLPC (Wafer-Level Packaging) Conference Proceedings


Miniaturizing RF Module Using Class Interposer Technology

Author: Ganesh Bhatt
Company: TE Connectivity
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Technology is evolving to make electronic products smaller and lighter with an increasing number of functions, with the demand for high density and high integration becoming more prevalent. 3D interposers for a system in a package will became more and more important for advanced electronic systems. 3D interposer is the technology where you stack up the active components on the glass substrate on both sides of the modular structure. The initial trend to this advanced technology was silicon interposers as it has offered compelling benefits for 3D system integration. Such systems, however, are limited by high cost and high electrical loss at frequencies higher that 200MHz. Glass has many properties that make it an ideal material for interposer substrates, which can be considered as having unique advantages compared to silicon. Glass has a low dielectric, which allows low insertion loss and low cross-talk for dense trace circuitry, a range of coefficients of thermal expansion (CTE) which can be tailored to match different components’ low thermal conductivity that to thermally isolate high heat-producing integrated circuit chips from temperature sensitive components, and relatively lower cost owing to large panel and potential roll-to-roll processing. In this paper we demonstrated the process of how a RF design was miniaturized from the standard FR4 substrate by a reduction of 64% by using glass as the substrate and still be able to use the same components and duplicate the functionalities that were proven on the FR4 design.



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