Development of Bump Support Film (BSF) For Improving Package Reliability of WlCSPAuthors: Masanori Yamagishi, Shinya Takyu, Naoya Saiki, Akinori Sato, Kazuyuki Tamura and Rey Alvarado
Company: Lintec Corporation and Qualcomm Technologies, Inc.
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
In order to apply to various pitches, bump heights and patterns, we studied changing PSA into bump absorption layer which was controlled elastic modulus at the large deformation region. As a result, we achieved a reducing the plasma etching time dramatically for removing BSL residues at the top of the bumps.
Thermosetting Resin, Bump Absorption Layer, Elastic Modulus at the Llarge Deformation Region
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