IWLPC (Wafer-Level Packaging) Conference Proceedings


RETRACTED: The Novel Liquid Molding Compound For Fan-Out Wafer Level Package

Authors: Katsushi Kan, Yosuke Oi, Yasuhito Fujii, Masato Miwa, and Michiyasu Sugahara
Company: Nagase ChemteX Corporation and Nagase & CO.,LTD.
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)


Seika Machinery, Inc.

Abstract: This paper has been retracted since it was previously published at a different conference.



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