FOWLP: Comparison & Highlight On The Last Technologies TrendsAuthor: Romain Fraux
Company: System Plus Consulting
Date Published: 10/18/2016 Conference: IWLPC (Wafer-Level Packaging)
Finally, latest evolutions of Package-on-Package (PoP) for application processor and memory are highlighted based on flagship smartphones teardown. Pictures of packages cross-sections from Samsung, Qualcomm and Apple will be shown, and we will describe and compare their choices in term of supply chain and technologies.
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