IWLPC (Wafer-Level Packaging) Conference Proceedings

FOWLP: Comparison & Highlight On The Last Technologies Trends

Author: Romain Fraux
Company: System Plus Consulting
Date Published: 10/18/2016   Conference: IWLPC (Wafer-Level Packaging)

Abstract: To highlight the last implementations of FOWLP, this work will address technological and cost review with comparison of several actual Fan-Out Wafer-Level Packages. With photos taken from physical analyses, we will describe and compare the design and manufacturing construction of FOWLP integrated in recent automotive radar applications from Bosch (Infineon radar chips with eWLB technology) and Continental (NXP radar chips with RCP technology). We will also present latest introduction of Qualcomm FOWLP in smartphone and will show why Qualcomm is going to provide more products with Fan-Out packages by comparing the cost structure with Fan-In WLP.

Finally, latest evolutions of Package-on-Package (PoP) for application processor and memory are highlighted based on flagship smartphones teardown. Pictures of packages cross-sections from Samsung, Qualcomm and Apple will be shown, and we will describe and compare their choices in term of supply chain and technologies.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819