CHIP SCALE PACKAGE SOLDER PASTE STENCIL PRINTING OPTIMIZATIONAuthor: Tom Long
Company: ITT Aerospace/Communications
Date Published: 9/12/1999 Conference: SMTA International
A dynamic Taguchi S/N L18 experiment was performed which analyzed the level effects of seven (7) control factors and two (2) noise factors over a three level signal factor. The results of this experiment have optimized the screen printing process and demonstrated consistent solder deposition thickness across all target configurations. The results of this Taguchi optimization will be used in an assembly optimization later this year examining solder joint reliability for Chip Scale Packages.
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