BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning ProcessesAuthors: Mike Bixenman, DBA¹, Mark McMeen² and Jason Tynes²
Company: KYZEN Corporation¹ and STI Electronics²
Date Published: 9/25/2016 Conference: SMTA International
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies states that validation and verification be confirmed with test vehicles that are representative of the product being produced. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies. The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components. The nonstandard test board has features to also study thermal paddle design options and to develop a risk profile. This research will report Surface Insulation Resistance effects at the source of the residue.
Bottom Terminated Components, J-STD-001, Flux Residues, Reliability, Warranty, Surface Insulation Resistance
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.