SMTA International Conference Proceedings


BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes

Authors: Mike Bixenman, DBA¹, Mark McMeen² and Jason Tynes²
Company: KYZEN Corporation¹ and STI Electronics²
Date Published: 9/25/2016   Conference: SMTA International


Abstract: It becomes necessary from time to time to change materials of construction, manufacturing processes, and process conditions. A soldering material or cleaning agent may become unavailable due to environmental regulation, market forces, or reformulation. The following conditions necessitate validation and verification: 1. New soldering and / or cleaning materials changes that may improve performance or be more cost effective. 2. New soldering or cleaning equipment. 3. Technology assembly advances using a wide range of components placed in highly dense footprints. Each of these conditions require some form of verification and validation that the process meets the Original Equipment Manufacturers (OEMs) quality and reliability specifications.

J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies states that validation and verification be confirmed with test vehicles that are representative of the product being produced. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies. The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components. The nonstandard test board has features to also study thermal paddle design options and to develop a risk profile. This research will report Surface Insulation Resistance effects at the source of the residue.

Key Words: 

Bottom Terminated Components, J-STD-001, Flux Residues, Reliability, Warranty, Surface Insulation Resistance



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