Author: Richard Freiberger Company: GSS Array Technology Date Published: 10/20/1997
Abstract: With the proliferation of notebook and hand held computer products the search for smaller, lighter, and more portable information processing is generating new developments in much smaller formats. The use of PC-Cards has made the expansion of these products possible by providing a universal format for the operation of different peripheral accessories. Products in this form factor are becoming very common with many companies that manufacture computer peripheral products. The physical restrictions in board outline and overall thickness require the use of fine pitch SMT along with the use of small discrete components. Processing these assemblies on thinner substrates presents challenges to the standard methods used and will require fundamental rethinking of the manufacturing process. Although this form factor presents us with new challenges it can be manufactured easier by focusing on the unique differences. Although these assemblies are smaller in size and are very tightly packed with surface mounted components, this article will attempt to Demystifying the manufacturing process.