Emerging Technologies Conference Proceedings


ADVANCED CHIP SCALE PACKAGES OFFER MANUFACTURING ADVANTAGES

Author: Ron Bauer
Company: Intel Corporation
Date Published: 10/20/1997   Conference: Emerging Technologies


Abstract: The size of handheld consumer products are shrinking at a staggering rate. These new products are being judged in millimeters and grams. Manufacturers of these products are not only requiring the smallest and lightest components, they are requiring components that help reduce cost, and meet their rapid development cycles. This has fueled the growth of Chip Scale Packages (CSP) to meet these needs. These new packages are not only smaller and lighter than their predecessors such as TSOP and QFP packages, but they also offer improved manufacturability, and package reliability that can be optimized for the needs of the application. These new CSP’s are enabling a new wave ultra small consumer products.



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