Author: Denis Barone Company: Omicron Technologies Inc. Date Published: 10/20/1997
Abstract: Electronic packaging designers of products such as portable computers, personal communication and navigation devices, satellites, and smart weapons are continually searching for ways to reduce package sizes, increase electronic content, and lower costs. The ability to fabricate a high density interconnect that would conform to the available space in these devices would result in more densely packaged electronics. The use of substrates that have molded-in features would consolidate parts and reduce assembly costs. This paper will review the technology under development for the fabrication of conformal high density interconnects. This includes substrate characterization, dielectric innerlayer materials and deposition techniques, circuit imaging technology, via formation, and metallization processes. A smart weapon application using the conformal interconnect will be demonstrated. The infrastructure developments that will be necessary to make this a broadly accepted technology such as CAD/CAE software, test and repair methods, and component assembly equipment will be reviewed.