Surface Mount International Conference Proceedings


SUCCESSFUL REWORK PROCESS FOR CHIP-SCALE PACKAGES

Author: Paul Wood
Company: OK International
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: As the Chip-Scale Package presents today’s electronics manufacturing industry with many challenges in both the rework and repair environment, one must seriously consider the specific criteria that must be adhered to, in order to implement a successful rework process. The intent of this paper is to touch upon how those particular requirements can be met, or even exceeded, while maintaining user friendliness.



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