Methods of Reducing or Eliminating Voids In BGA And BTC DevicesAuthors: Mitch Holtzer and T.W. Mok
Company: Alpha Assembly Solutions
Date Published: 4/12/2016 Conference: Symposium
Also, voids are very good insulators of heat, leading to thermal issues with heat sinks and thermal pads often used in power devices.
This presentation will discuss both laboratory and field data that needs to be shared with circuit assembly engineers and designers who need to minimize voiding in tin lead and lead free assemblies.
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