Symposium Conference Proceedings

Methods of Reducing or Eliminating Voids In BGA And BTC Devices

Authors: Mitch Holtzer and T.W. Mok
Company: Alpha Assembly Solutions
Date Published: 4/12/2016   Conference: Symposium

Abstract: Voids are an area of concern for the long term durability and functionality of electronic devices. Voids near or at the interface of surface mount technology (SMT) component input/outputs (I/O’s), or the circuit board substrate can be highly probable initiators of crack propagation, leading to the high possibility of a field failure.

Also, voids are very good insulators of heat, leading to thermal issues with heat sinks and thermal pads often used in power devices.

This presentation will discuss both laboratory and field data that needs to be shared with circuit assembly engineers and designers who need to minimize voiding in tin lead and lead free assemblies.

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